- **Semiconductor Secondary Piping**: Secondary piping, referred to as HOOK-UP in English, refers to the engineering that connects process equipment to various main pipelines. It mainly involves systems such as gas, process cooling water, ultrapure water, wastewater and chemical waste liquid, and exhaust gas. Secondary piping is generally carried out after the installation of main pipelines and process equipment. Its pipe diameter is smaller than that of main pipelines. The work content includes the docking of pipelines with original gas supply equipment, the docking of pipelines with the corresponding calibers of user equipment, and the addition of shut-off valves, gas mixing cabinets and other equipment according to actual conditions. The secondary piping system is directly related to chip quality and production efficiency. It needs to ensure stable and pure gas supply, have good pressure and flow control capabilities, and at the same time meet strict safety standards with maintainability and flexibility.
- **EPDM Formed Gasket**: EPDM, or ethylene propylene diene monomer, formed gaskets have excellent aging resistance and can remain stable for a long time in harsh environments such as high temperature, low temperature, and ultraviolet radiation. They have good sealing performance, and their unique rubber elasticity can adapt to sealing surfaces of different shapes and sizes, effectively preventing liquid or gas leakage. In addition, EPDM formed gaskets have good chemical resistance to most chemicals and can be used in corrosive environments such as acids, alkalis, and salts. Their general operating temperature range is around -30°C to 130°C, making them widely used in sealing scenarios in industries such as electronics, automobiles, and construction.
- **FKM Formed Gasket**: FKM is a type of fluororubber. FKM formed gaskets have excellent chemical resistance and can remain stable in various chemical medium environments such as acids, alkalis, salts, and oils. They have outstanding high and low temperature resistance, maintaining good physical properties and sealing performance over a wide temperature range. At the same time, they have high resilience and compression resistance, ensuring good sealing effect even in high-pressure environments. They can also resist damage from certain high-radiation and high-vacuum environments, making them commonly used in harsh industrial environments with high sealing requirements such as semiconductor manufacturing.
- **E-PTFE Gasket**: E-PTFE, or expanded polytetrafluoroethylene, gaskets are made of 100% expanded polytetrafluoroethylene. They feature low clamping force, good dimensional stability, and chemical resistance, capable of withstanding all media except molten/dissolved alkali metals and elemental fluorine (pH 0 - 14). They have high conformability to common flange defects and can achieve tight sealing even under harsh conditions, maintaining long-term sealing effect by sustaining bolt clamping force.
- **E-PTFE Sealing Tape**: E-PTFE sealing tape is an ideal on-site formed gasket material made of 100% pure expanded polytetrafluoroethylene with a foam structure. It has a pressure-sensitive adhesive backing on one side for easy installation and positioning. E-PTFE sealing tape has excellent chemical resistance, tolerating all chemicals from pH 0 to 14, with a temperature range of -200°C to 280°C (up to 315°C for short periods). It has strong pressure resistance, usable under pressures from vacuum to 200 bar, with a compressibility of up to 60% and a resilience of 14%, achieving excellent sealing even under minimum torque loads.
- **PTFE Bonded EPDM Gasket**: PTFE bonded EPDM gasket is a composite gasket made of polytetrafluoroethylene and ethylene propylene diene monomer rubber. This type of gasket combines the high-temperature resistance, excellent chemical and corrosion resistance of PTFE with the good compression and resilience properties of EPDM. It is suitable for medium and low pressure and harsh operating conditions, and can be used in plastic, glass fiber, glass-lined pipeline systems, etc.